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eda-research埃达研究

Agent Skill

eda-research 用于查找、检索和筛选相关信息,适合在 Codex、Claude、Cursor、Gemini CLI 中需要根据关键词、任务场景或来源线索快速定位候选结果时使用。可结合来源仓库、安装命令和原始 README 继续核验具体用法。安装前建议确认权限范围、维护状态,以及是否会触发联网、命令执行或文件读写。

总安装

749

周安装

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下载量

242
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安装说明

本站只整理中文说明和来源信息,不托管安装包,也不代用户安装。

GitHub

来源数

3

许可证

MIT

最后核验

2026-05-01

来源状态

来源可访问

安装方式

通过对话安装

复制提示词发给支持本地命令或 Skills 的 AI 助手,先确认命令和权限,再让它执行。

请帮我安装这个 Agent Skill:eda-research(埃达研究)
来源仓库:https://github.com/l3wi/claude-eda
仓库路径:skills/eda-research
安装命令:
npx skills add https://github.com/l3wi/claude-eda --skill eda-research
安装前请先检查当前环境是否支持对应 CLI,并向我确认将要执行的命令、安装目录、联网范围和文件读写权限;确认后再执行。

命令行安装

复制命令到本机终端执行。不同来源提供的安装方式可能略有差异;本站展示可直接复制的安装命令,安装前请核对来源页面。

skills.shnpx skills
npx skills add https://github.com/l3wi/claude-eda --skill eda-research

简介

eda-research 用于为电子项目选择和推荐合适的元器件。

  • 适合在寻找 MCU、稳压器、传感器等关键器件,或需要 LCSC 编号、数据手册支持时使用。
  • 需基于项目约束条件生成可读的组件选型报告,供后续设计参考。
  • 使用前应确认设计需求文档存在,并注意其可能访问外部资源或生成新文件。
  • 适用宿主包括 Codex、Claude、Cursor、Gemini CLI,接入前应确认版本、权限和运行环境要求。

SKILL.md

EDA Research Skill

Source and select components for electronics projects.

Auto-Activation Triggers

This skill activates when:

  • User asks to "find a component", "search for", "source"
  • User asks about component specifications or comparisons
  • User mentions LCSC, datasheets, or part numbers
  • User asks "what MCU/regulator/sensor should I use"
  • Project has design-constraints.json but missing component selections

Context Requirements

Requires:

  • docs/design-constraints.json (or prompt user for requirements)
  • docs/project-spec.md (optional, for context)

Produces:

  • docs/component-selections.md - Human-readable selection log
  • docs/bom-draft.json - Machine-readable BOM
  • datasheets/*.pdf - Downloaded datasheets for selected components

Workflow

1. Load Context

Read existing project constraints:

@docs/design-constraints.json
@docs/project-spec.md
@docs/component-selections.md (if exists)

If constraints missing, ask user for minimum requirements:

  • What does this component need to do?
  • Key specifications (voltage, current, package)?
  • Budget constraints?

2. Understand Requirements

For the target component role, identify:

  • Critical specifications (must-have)
  • Preferred specifications (nice-to-have)
  • Package preferences (SMD size, through-hole)
  • Any specific brands or series to consider/avoid

2.5 Check Architecture Constraints

Before searching, review design-constraints.json for:

  • Power topology: LDO vs buck decision already made in architect phase
  • Thermal budget: Max watts for this role (check thermal.hotComponents)
  • DFM targets: Assembly method affects package choice
  • Board layers: May affect component density

For power components, see reference/REGULATOR-SELECTION.md for selection criteria. For passives, see reference/PASSIVE-SELECTION.md and reference/DECOUPLING-STRATEGY.md.

3. Research Options

Use web search to understand:

  • Common solutions for this application
  • Recommended parts from reference designs
  • Known issues or considerations
  • Alternative approaches

4. Search JLC

Use mcp__jlc__component_search to find candidates:

  • Search with specific parameters
  • Filter by stock availability
  • Note pricing at target quantity
  • Check for "Basic" parts (lower assembly fee at JLCPCB)

5. Analyze Candidates

For top 3-5 options:

  • Download/fetch datasheets
  • Extract key specifications
  • Check application circuits
  • Note layout requirements
  • Identify any gotchas

5.5 Validate Against Constraints

Before presenting options, verify each candidate:

Thermal validation:

P_dissipation = (calculated from datasheet)
Thermal budget = (from design-constraints.json)
✓ P_dissipation < Thermal budget

Assembly compatibility:

  • Hand assembly → 0603/0805 minimum, no fine-pitch
  • Reflow → 0402+ OK
  • Turnkey → Check JLCPCB availability

Architecture compliance:

  • Meets LDO/buck decision from architect phase
  • Noise specs OK for rail type (analog vs digital)
  • Efficiency acceptable for battery applications

Flag any candidates that fail validation with specific concerns.

6. Present Comparison

Create a comparison table:

PartMPNKey SpecsPriceStockProsCons
.....................

Include recommendation with rationale.

7. Confirm Selection

  • Get user confirmation
  • Document selection with rationale
  • Update constraint file
  • Save datasheet

8. Validate Symbol (After library_fetch)

When fetching online components with mcp__jlc__library_fetch, analyze the returned validation_data:

Quick checks:

CheckExpectedAction if Failed
pin_pad_count_matchtrueCheck for exposed pads (EP)
has_power_pinstrue (for ICs)Review pin types
has_ground_pinstrue (for ICs)Review pin names

Common issues:

  • QFN/BGA packages often have exposed thermal pads (EP) not included in symbol
  • Pin electrical types may be incorrect (power pins marked as passive)
  • Pin names may not match datasheet

Fixing with library_fix:

Use mcp__jlc__library_fix to regenerate symbol with corrections:

mcp__jlc__library_fix lcsc_id="C#####" corrections='{
  "pins": [
    { "action": "add", "number": "EP", "name": "GND", "type": "passive" },
    { "action": "modify", "number": "1", "set_type": "power_in" }
  ]
}'

Correction actions:

  • add - Add missing pin (number, name, type required)
  • modify - Rename and/or change electrical type
  • swap - Swap positions of two pins
  • remove - Remove incorrect pin

Output Format

component-selections.md Entry

### [Role]: [Part Name] ([LCSC Number])

**Selected:** [Date]
**MPN:** [Manufacturer Part Number]
**Manufacturer:** [Name]
**Price:** $X.XX @ [quantity]

**Specifications:**
- Key spec 1: value
- Key spec 2: value

**Rationale:**
[Why this part was chosen over alternatives]

**Alternatives Considered:**
- [Part 2] - rejected because [reason]
- [Part 3] - rejected because [reason]

**Design Notes:**
- [Any layout or application notes from datasheet]

**Datasheet:** `datasheets/[filename].pdf`

bom-draft.json Entry

{
  "role": "regulator-3v3",
  "lcsc": "C6186",
  "mpn": "AMS1117-3.3",
  "manufacturer": "AMS",
  "description": "3.3V 1A LDO Regulator",
  "value": "3.3V",
  "footprint": "SOT-223",
  "quantity": 1,
  "unitPrice": 0.04,
  "extendedPrice": 0.04,
  "category": "power",
  "basic": true
}

Component Role Categories

See reference/COMPONENT-CATEGORIES.md for detailed role definitions.

Common roles:

  • mcu - Main microcontroller
  • regulator-Xv - Voltage regulators
  • crystal - Oscillators/crystals
  • connector-* - Various connectors
  • esd-* - ESD protection
  • decoupling-* - Bypass/bulk capacitors
  • led-* - Indicator LEDs
  • sensor-* - Various sensors

Guidelines

  • Prefer JLCPCB "Basic" parts when suitable (lower assembly cost)
  • Check stock levels - avoid parts with < 100 in stock
  • Consider package size vs hand soldering capability
  • Note lead times for non-stock items
  • Always document why a part was chosen
  • Download datasheets for all selected components
  • Identify 1-2 alternatives for critical components (see reference/COMPONENT-ALTERNATIVES.md)
  • Validate thermal before confirming power components
  • Check architecture decisions from design-constraints.json before selecting

Reference Documents

DocumentUse For
REGULATOR-SELECTION.mdLDO vs Buck selection criteria
DECOUPLING-STRATEGY.mdCapacitor values for ICs
PASSIVE-SELECTION.mdResistor/capacitor fundamentals
COMPONENT-ALTERNATIVES.mdFinding equivalent parts
DATASHEET-ANALYSIS.mdExtracting key specs
COMPONENT-CATEGORIES.mdRole naming conventions
JLC-SEARCH-TIPS.mdSearch strategies

Next Steps

After component selection is complete:

  1. Run /eda-source for remaining components
  2. When all components selected, run /eda-schematic
  3. Update design-constraints.json stage to "schematic"

适合场景

01

用户想查找某类 Agent Skill 时

02

需要根据任务场景推荐可安装能力包时

03

需要对比不同来源的安装命令和来源信息时

04

需要参考平台分布和安装热度时

能力概览

能力 1

按任务关键词查找相关 Skills

能力 2

展示可复制的安装命令

能力 3

保留来源站点、仓库和原始说明,方便继续核验

能力 4

补充不同宿主或平台的使用分布数据

能力 5

展示第三方安全扫描或审计结果

安装后应在对应宿主中按原始 README 的触发条件使用;具体调用方式请以来源页面和 README 为准。

平台分布

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2.88%
按下载量换算7

安全审计

Gen Agent Trust Hub

通过

Socket

通过

Snyk

可疑

权限和风险

external-service

该 Skill 可能调用第三方服务、云服务或外部模型 API,使用前需要确认账号、额度、数据发送范围和服务条款。

安装前确认

本站仅展示第三方公开信息,不托管安装包,不提供自动安装或运行环境。安装前应自行审查源码、依赖和命令行为。来源安全扫描存在 warning/failed 结果,不能写成本站确认安全。

来源信息

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